Description
One part Low-Stress adhesive and Potting compound . Thermally conductive adhesive formulated to use in the maunufacture of computer components and LED’s with significant heat generation material that has an outstanding thermal stability and chemical resistance. Designed to bond a heat producing component to a heat sink. Additional applications include die attachment, printed circuit board fabrication and advanced material composites.
109-12 is a one component, highly thermally conductive, low stress, low shrink potting compound and adhesive. 109-12 features exceptional resistance to thermal cycling. Recommended applications include potting of dissimilar materials requiring class “F+” service temperature rating. 109-12 is a more thermally conductive version of 108-50.
Viscosity (cps) 500,000 @ Room Temperature
60,000 @ 50°C
Volume Resistivity (Ω-cm) 1 x 1014
Dielectric Constant (1 kHz) 5.3
Dielectric Factor (60 Hz) 0. 018
Hardness (Shore D) 80 @ Room Temperature
35 @ 121°C
Thermal Conductivity (W/mK) 5.65
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