Description
High strength, non-shrinking, adhesive/potting compound specially formulated for high clarity, good impact strength and water resistance. The adhesive bond is resistant to weathering, solvents and wide variations in temperature.
Listed under NSN stock #8040-00-162-9704
Key Features:
- 100% reactive, no solvents
- Good water and chemical resistance
- Fills gaps and voids
- Room temperature curing
Recommended Uses:
Bonding or potting electronic components and assemblies
Creating moisture-resistant seals
Suitable for bonding ceramics, ferrous and non ferrous, ferrites, wood, glass and concrete.
Physical Properties:
| Color: | Clear |
| Mixed Viscosity: | 8,000 cps |
| Mix Ratio by Volume | 1:1 |
| Mix Ratio by Weight | 1.2:1 |
| Mixed Density: | 1.10 gm/cc |
| Working Time: | 8-12 minutes @ 72 ̊ F |
| Fixture Time: | 30-35 min. @ 72 ̊ F |
| Functional Cure: | 2 hrs. |
| Full Cure: | 16 hrs. |
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