Description
PERMABOND® UV683 has been developed for use as a coating. It is ideal for coating and doming applications. The optically clear / tack-free formulation also makes this product particularly suitable for coating smart card microchips amongst various other applications. Its viscosity makes it suitable for encapsulation of electronic components and its high temperature resistance allows it to resist wave-soldering.
Features & Benefits
- Cure on demand
- Ideal viscosity for doming
- Tack free
- Fast curing with low-power lamps
- 100% solids, no solvents
Physical Properties of Uncured Adhesive
| Chemical Composition | Acrylate |
| Appearance | Colorless |
| Viscosity @ 25°C | 1,000-1,600 mPa.s (cP) |
| Specific Gravity | 1.1 |
Typical Curing Properties
| Typical fixture time* | Low power 4mW/cm² battery lamp: 7 secs LED 100mW/cm² lamp: 2 secs UV light guide 30W/cm²: 1 sec |
| Tack free time | Low power 4mW/cm² battery lamp: 15 secs LED 100mW/cm² lamp: 5 secs UV light guide 30W/cm²: 1-2 secs |
| Cure wavelength | 320 – 420 nm** |
*The cure time depends on the power of the UV lamp, its spectral
output, the distance between the lamp and the components, and
the transmission characteristics of the substrates.
**LED UV lamps have a narrow range of spectral output. It is
important to check suitability with Permabond in order to match
the LED lamp’s peak wavelength with that of the adhesive’s
photoinitiator to ensure optimal adhesive cure.
Typical Performance of Cured Adhesive
| Tensile Strength (ISO37) | 12-14 N/mm² (1700-2000 psi) |
| Light Transmittance | >98% |
| Refractive Index | >1.490 |
| Elongation at break (ISO37) | >50% |
| Hardness (ISO868) | 50-65 Shore D |
| Water absorbtion (ISO62) 2 hours in boiling water |
<2% |
| Glass transition (Tg) DSC 20°C/min rate |
+55°C |
*Strength results will vary depending on the level of surface preparation and gap.
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