Description
Permabond ET5441 is a thixotropic, thermally conductive two-component adhesive based on epoxy resin. It is specifically designed to bond metal substrates when excellent resistance to high temperature is required. The full cure is achieved in 7 days at room temperature, but it can be obtained in 24 hours at room temperature followed by 30 minutes at +80°C (176°F). Permabond ET5441 provides excellent resistance to motor oil, glycol and hot and cold water.
Permabond ET5441 has been specifically formulated to meet the requirements of:
- Flammability rating UL94 HB
- Thermal vacuum outgassing test for the screening of space material ECSS-Q-ST-70-02C
Features & Benefits
- Full cure at room temperature
- Adhesion to a variety of substrates
- Thermally conductive
- High temperature resistance
- Excellent chemical resistance
Physical Properties of Uncured Adhesives
| ET540 A Side | ET540 B Side | |
| Chemical composition |
Epoxy Resin | Amine Hardener |
| Appearance | White | Dark Grey |
| Viscosity @ 23°C | 25,000 mPa.s (cP) Thixo | 22,000 mPa.s (cP) Thixo |
| Specific gravity | 2:1 | 2.1 |
Typical Curing Properties
| Mix ratio | 2:1 by weight 2.1 by volume |
| Maximum gap fill | 2 mm 0.08 in |
| Usable / pot life @23°C | 150 minutes |
| Handling time @23°C | 150 minutes |
| Working strength @23°C | 8 hours |
| Full cure @23°C | 23°C (77°F): 7 days 80°C (176°F): 2 hours |
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