Description
Devcon Food Grade Pot & Seal is a two-component adhesive for bonding aluminium, steel and steel cloth. Require heat curing of the polymer to attain full physical properties. Used in the food processing industry for bonding stainless steel screens.
KEY FEATURES
- Complies with 21 CFR 175.300 (dry food only)
- Excellent thermal shock resistance
- Must be heat cured for full physical properties
- Excellent chemical, heat and water resistance
- Bond stainless steel with superior flex and adhesion
- Open Time: 10 minutes
- Fixture Time: 42 minutes
- Gap Fill: 0.01″ – 0.05″
- Working Time Min: 40
- Working Time Max: 45
PHYSICAL PROPERTIES
| Uncured | |
| Color | White |
| Heat Cure 10 min. @ 200°F | 1,940 psi |
| Heat Cure 15 min.@180°F | 1,980 psi |
| Mix Ratio by Volume | 4:1 |
| Mix Ratio by Weight | 100;25 |
| Mixed Density | 10.5 lbs./gal. : 1.26 gm/cc |
| Mixed Viscosity | 100,000 cps |
| Working Time | 42 min [28 gm @ 72°F] |
| Cured 7 days @ 75° F | |
| Dielectric Strength | 460 volts/mils |
| Gap Fill | Excellent |
| Impact Resistance | 5.2 ft.lb./in.(2) |
| Service Temperature | -40°F to 275°F |
| Shore Hardness | 82 Shore D |
| Solids by Volume | 100 |
| Specfic Volume | 22.00 in.(3)/lb. |
| Tensile Elongation | 1% |
| Tpeel | 2-3 pli |
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