The processes of potting and encapsulating with adhesives are some of the most crucial to safety and function in electronic scenarios. Potting, encapsulating, and coating, while each a bit different, typically involve the dipping, coating, or pouring of resin molds in and around the electronic device. This process ensures that the device, for instance, a circuit board, is safe from the hazards of moisture, dust, chemicals, mechanical variables, and thermal and shock vibration.

Printed Circuit Boards (PCBs) are integral parts of thousands of domestic, industrial, automotive, and military devices, and while PCBs do amazing things, they are highly vulnerable to moisture and dust. So, to protect them, manufacturers use either Potting and encapsulants or conformal coatings.

The potting and encapsulating processes are typically used to protect semiconductor components from mechanical damage, but perhaps more importantly, from moisture. Additionally, these processes are used in high voltage products to allow live parts to be placed much closer together, so that the overall size of the finished product can be more compact.

Chemical Concepts carries a wide inventory of potting and encapsulating products – let’s shine the spotlight on two types of those products here.

Addition Curing Silicones

Addition cure silicones are two-part solutions that require the mixture of a silicone polymer with a catalyst (typically platinum) to ensure a cure.

• Addition cure silicones are often preferred over condensation curing silicones because they have little to no trouble with section thickness and do not need moisture to achieve cure.
• Typically, addition cure silicones are the best choice for high temperature applications.
• Addition cure silicones usually require more careful and accurate mixing than condensation cure ones.
• These cure with virtually no shrinkage.
• Many addition curing silicones have skin safe, food safe, and transparent versions.

A Top-Selling Addition Curing Silicone Product

ChemSet 412 Clear Electronic Potting Silicone

ChemSet 412 Clear Electronic Potting Silicone is a low viscosity, two-component, addition cure, silicone elastomer which will cure at room temperature or at elevated temperatures. It has a low viscosity, which allows for ease of flow around complex parts, providing electrical insulation and shock resistance.

Some of its Top Features

• Medium viscosity.
• Low linear shrinkage.
• Transparent.
• Fast room temperature cure.

Condensation Curing Silicones

Condensation cure silicones are either one or two-component silicones that need moisture in order to achieve cure. This moisture can either be extracted from the environment or from within its actual makeup, with the help of a catalyst (typically tin salts).

These products are a bit more “workhorse” oriented as they are often leveraged for mold-making, encapsulating, high-performance coatings, sealants, and pressure sensitive release coatings.  In most applications, condensation cure silicones are more tear resistant than addition cure silicones.

A Top-Selling Condensation Curing Silicone Product

QSil 13

QSil 13 is a clear, transparent, low viscosity, two-component, liquid silicone material which cures at room temperature and can be used for coating or potting applications. This material is typically mixed at a 100:5 ratio. Once mixed, the material is self-leveling and will have a useful work-life of approximately two hours. The material will be fully cured after 24 to 48 hours at room temperature. This material can also be vulcanized at elevated temperatures (up to 70°C) to increase the cure speed.

Some of its Top Features

• Low viscosity.
• Variable cure speed, with mild heat.
• Transparency.
• Room temperature cure.
• Good adhesion with use of a primer.

See an overview of all of the potting and encapsulating products offered by Chemical Concepts here.

Our experienced sales team can help you determine what products will work best for your needs. Call us toll-free at 800-220-1966 or email [email protected].