CHT Group QGel 303 Soft Two Part Silicone Potting Gel

Description

QGel 303 is a soft, two part silicone gel that protects sensitive electronics from vibration, thermal shock, and mechanical shock while sealing out moisture. It mixes one to one by weight and reaches a soft gel state in about nine minutes at room temperature.

Where QGel 303 Is Used

This gel pots and encapsulates circuit boards, sensors, and small modules that need a cushioned, reworkable cover rather than a hard block. The low cross link density keeps the cured gel soft enough to absorb shock and to be cut away for repair, while still holding components in place. It suits transportation electronics, control modules, and any assembly that sees repeated vibration. Because the cured material can be peeled back or cut and a board re-potted, it also fits prototype runs and field serviceable units where access matters later in the product life.

How QGel 303 Cures and Performs

The two parts pour and blend easily at a one to one ratio, then cure by addition with no byproducts and almost no shrinkage. A fast nine minute gel time at room temperature speeds up production, and gentle heat shortens it further. Once set, the transparent purple gel lets a technician inspect the potted assembly and confirm full coverage. Mixed volumes self level into tight spaces around fine pitch components and under low standoff parts, so the cured gel reaches every gap without trapped voids.

Specifications

Order the packaging size that fits your pour volume, and compare adjacent grades in our encapsulants and potting compounds when you need a firmer or slower set. For background on the silicone gel family, see CHT Group.

Need Help?

Need help spec’ing a potting gel for your board and operating temperature? Call (800) 220-1966 or email [email protected].