Description
QSil 556 is a two-component, addition-cure silicone potting compound designed for electrical encapsulation. The low viscosity system allows for complete wet-out of components and penetration into tight geometries.
With a 72-minute gel time, this formulation supports detailed potting applications and larger pours. The cured material provides thermal conductivity, electrical insulation, and low modulus protection for sensitive components.
Key Product Details
| Property | Value |
|---|---|
| Mix Ratio | 1:1 |
| Gel Time @ 25°C | 72 minutes |
| Viscosity (Mixed) | Low viscosity system |
| Hardness | 50 Shore A |
| Tensile Strength | 250 psi |
| Elongation | 90% |
| Thermal Conductivity | ~0.37 W/m·K |
| Temperature Range | -55°C to 204°C |
| UL Rating | UL 94 V-0 |
Performance in Production
- Flows into tight geometries and complex assemblies
- Long gel time supports large pours and degassing
- Low modulus reduces stress on components
- Provides electrical insulation and thermal transfer
- Compatible with manual and automated mixing
Common Applications
- Electronic potting and encapsulation
- Power modules and control boards
- LED drivers and power supplies
- Sensors and industrial electronics
Available Sizes
- 2 Kg Quart Kit
- 10 Kg Gallon Kit
- 44 Kg Pail
- 440 Kg Drum
Reviews
There are no reviews yet.