Description
Insulcast I-Bond 5-171-1 is a two-part flexible epoxy potting compound for encapsulating electronics that need moisture sealing and vibration damping across a wide temperature range. It cures to a resilient mass that holds up from -55 C to 150 C. Sold as matched Part A (resin) and Part B (hardener) in 55 gallon drums. Select the part you need above.
Insulcast I-Bond 5-171-1 Benefits
- Flexible cured hardness (Shore A 80-90) absorbs shock and vibration instead of passing it to components.
- Wide -55 C to 150 C service range covers demanding thermal cycling.
- Seals out moisture, dust, and contaminants for long field life.
- Strong dielectric protection keeps components electrically isolated.
- Long 1 to 2 hour pot life gives crews time to pour and place large assemblies.
- Backed by ITW Performance Polymers.
Common Applications
- Potting power supplies, transformers, and coils
- Sealing sensors, connectors, and control modules
- Protecting LED and lighting electronics
- Encapsulating medical device electronics
- EV and e-mobility power electronics
Typical Properties
- Mix ratio (by weight): 90:80
- Viscosity (Part A): 1,800 cP
- Pot life (25 C): 1 to 2 hr (gel 4 to 6 hr)
- Cure: 48 hr at 25 C or 3 hr at 77 C
- Hardness: Shore A 80-90
- Service temperature: -55 to 150 C
Surface Prep and Use
Mix Part A and Part B at 90:80 by weight until uniform. Pour or pump the mixed compound around the assembly, and degas under vacuum for a void-free pot in critical parts. Allow 48 hours at 25 C, or 3 hours at 77 C, for full cure.
Ordering and Product Support
This compound sits in our potting and encapsulation compounds line. Review manufacturer resources at ITW Performance Polymers.
If you need help matching a potting compound to your thermal, dielectric, and cure requirements, call (800) 220-1966 or email [email protected].
Reviews
There are no reviews yet.