Description
CHT Group QGel 329 is a QGel 329 silicone gel for clear, soft encapsulation in electronics and assemblies that need a flexible protective fill. The two-part addition-cure material mixes 1:1 by weight and can cure at room temperature or with heat for faster processing.
QGel 329 Silicone Gel Benefits
- Clear general purpose gel supports inspection and visual identification after cure.
- 1:1 mix ratio simplifies hand mixing, cartridge filling, and bench dispensing.
- Soft but resilient cured gel helps cushion components against vibration and mechanical shock.
- Low-viscosity A and B sides flow around leads, connectors, and irregular cavities.
- Room-temperature or heat-cure options let the process match the part and production pace.
This gel is useful when a rigid potting compound would place too much stress on delicate parts. It can fill around wires, sensors, connectors, and control components while staying soft after cure. Test the actual enclosure, component materials, and cure depth before production so the gel reaches the needed surface, adhesion, and handling condition.
Common Applications for QGel 329 Silicone Gel
- Soft encapsulation of electronic modules and circuit assemblies.
- Connector fill where vibration and moisture exposure are concerns.
- Sensor, LED, and control housing protection with a transparent gel.
- Bench potting work that does not require dedicated dispensing equipment.
- Assemblies that need low-modulus stress relief around fragile components.
Compatible Materials and Handling Notes
- Use with clean electronic components, housings, connectors, and cable exits after testing.
- Keep the A and B sides from the same lot together when possible for best consistency.
- Mix carefully to limit unmixed streaks and trapped air in clear applications.
- Confirm service exposure before use around fuels, cleaners, or aggressive chemicals.
QGel 329 Silicone Gel Technical Specifications
| Property | Value |
|---|---|
| SKU | QUA QGEL 329 |
| Product type | General purpose silicone gel |
| Cure type | Addition cure |
| Color | Transparent |
| Mix ratio by weight | 1:1 |
| Gel time at 25 C | 1.5 hours |
| Cure profile | 20 minutes at 150 C, 60 minutes at 100 C, or 24 hours at 25 C |
| Penetration | 5 to 10 mm with 19.5 g cone |
| Viscosity | 950 cP A side, 950 cP B side |
| Working temperature range | -55 C to 204 C |
Packaging and Ordering
Order this gel when a soft, clear encapsulant is needed for electronic protection or low-stress potting. Browse related encapsulants and potting compounds, and review current manufacturer capabilities from CHT.
Need Help?
Need help choosing gel softness, cure method, or package size for your enclosure? Call (800) 220-1966 or email [email protected].
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