Description
Chem-Set 04 White Potting Adhesive is an electronics encapsulating compound for LED, PCB, and small assembly work. This 04 potting adhesive is used where components need coverage against moisture exposure, vibration, and handling stress while maintaining a clean poured finish around the assembly.
04 Potting Adhesive Benefits
- Self-leveling flow helps the material settle around components and board features.
- 10:1 mix ratio supports cartridge or meter-mix workflows where the package is matched correctly.
- White color gives covered components a uniform appearance after potting.
- Moisture protection helps shield electronic assemblies in housings, modules, and fixtures.
- Catalyst adjustment can change cure speed when the process allows controlled testing.
This potting material fits bench and production work where a poured adhesive is used to ruggedize sensitive parts. Prepare the assembly, control the mix ratio, avoid trapping air around tall components, and let the material cure before placing the module under electrical or mechanical service loads.
Common Applications for 04 Potting Adhesive
- Ruggedizing LED and PCB components.
- Surface-mounted LED assembly protection.
- Environmental protection around small electronics and board components.
- Potting assemblies that need a white, self-leveling fill.
- Repair and prototype work where a pourable compound is easier than hand-applied sealant.
Compatible Electronics and Process Notes
- Printed circuit boards, LED modules, small housings, and protected component pockets.
- Assemblies that can be fixtured level while the compound flows and cures.
- Mixing systems that can maintain the 10:1 ratio through the full dispense.
- Applications where thermal exposure stays within the listed operating range.
04 Potting Adhesive Technical Specifications
| Property | Value |
|---|---|
| SKU | CCS04 |
| Product type | White potting adhesive |
| Mix ratio | 10:1 |
| Flow | Self-leveling |
| Color | White |
| Use case | LED and PCB encapsulation |
| Operating temperature | -55 C to 204 C (-67 F to 400 F) |
Packaging and Ordering
Use this compound when an electronics assembly needs a controlled white potting material with a 10:1 process. Browse related encapsulants and potting compounds for other electronics protection materials. For industry context on silicone materials in electronics assembly, visit the Adhesive and Sealant Council.
Need Help?
Need help matching potting depth, dispense equipment, or cure timing to your electronics assembly? Call (800) 220-1966 or email [email protected].
Reviews
There are no reviews yet.