Description
Permabond ET5441 is a thixotropic, thermally conductive two-component epoxy adhesive designed for bonding metal substrates where high temperature resistance is required. It provides 1.1 W/(m.K) thermal conductivity and maintains structural bond strength on steel, aluminum, stainless steel, carbon fiber, GRP, FRP, ABS, and polycarbonate substrates.
ET5441 is formulated to meet UL94 HB flammability requirements and thermal vacuum outgassing screening requirements for space materials under ECSS-Q-ST-70-02C.
Key Product Details
| Property | Value |
|---|---|
| Product | Permabond ET5441 |
| Chemistry | Two-part epoxy |
| Cure mechanism | Room temperature cure |
| Mixed color | Dark grey |
| Mix ratio | 2:1 by weight, 2:1 by volume |
| A-side appearance | White |
| B-side appearance | Dark grey |
| A-side viscosity @ 23°C | 25,000 mPa.s, thixotropic |
| B-side viscosity @ 23°C | 22,000 mPa.s, thixotropic |
| Specific gravity | 2.1 |
| Maximum gap fill | 2 mm / 0.08 in |
| Usable / pot life @ 23°C | 150 minutes |
| Working strength @ 23°C | 8 hours |
| Full cure @ 23°C | 7 days |
| Full cure @ 80°C | 2 hours |
| Thermal conductivity | 1.1 W/(m.K) |
| Service temperature | -40°C to +200°C |
| Steel shear strength | 20 to 25 N/mm² / 2900 to 3625 psi |
| Aluminum shear strength | 17 to 21 N/mm² / 2465 to 3045 psi |
| Stainless steel shear strength | 20 to 25 N/mm² / 2900 to 3625 psi |
| Carbon fiber shear strength | 25 to 30 N/mm² / 3625 to 4350 psi |
| GRP shear strength | >10 N/mm² / >1450 psi |
| FRP shear strength | >19 N/mm² / >2755 psi |
| ABS shear strength | >6 N/mm² / >870 psi |
| Polycarbonate shear strength | 2 to 4 N/mm² / 290 to 580 psi |
| Tensile strength at break | 50 N/mm² / 7250 psi |
| Elongation at break | 2.9% |
| Hardness | 85 to 95 Shore D |
| Tg, 7 days @ 23°C | 65°C / 149°F |
| Tg, 24 hr @ 23°C + 30 min @ 80°C | 113°C / 235°F |
| Coefficient of thermal expansion below Tg | 23 x 10-6 /K |
| Coefficient of thermal expansion above Tg | 111 x 10-6 /K |
| Storage temperature | 5°C to 25°C / 41°F to 77°F |
| Requirements | UL94 HB, ECSS-Q-ST-70-02C thermal vacuum outgassing screening |
Performance in Production
- Thixotropic consistency helps control flow during dispensing and assembly.
- Designed for metal bonding where heat transfer and high temperature resistance are required.
- 150 minute pot life supports longer positioning and assembly windows.
- Reaches working strength in 8 hours at 23°C.
- Full cure is achieved in 7 days at 23°C or 2 hours at 80°C.
- Heat can be used to accelerate cure.
- Lower temperatures will slow cure speed.
- ET5441 can withstand higher temperatures for brief periods, including paint baking and wave soldering processes, when the joint is not unduly stressed.
- Provides excellent resistance to motor oil, glycol, and hot and cold water.
- Surfaces should be clean, dry, and grease-free before bonding.
- Some metals, including aluminum, copper, and copper alloys, may benefit from light abrasion before bonding.
- Not recommended for use in contact with strong oxidizing materials.
- Due to viscosity, 50ml cartridges may be difficult to dispense when cold. Warm cartridges before dispensing through a static mixing nozzle.
Common Applications
- High temperature metal bonding
- Bonding heatsinks
- Potting and encapsulating electronic parts
- Bonding SMDs
- Heat exchangers
- Electrical transformers, coils, and windings
- Bonding battery packs and housings
- Electric motor components
- Electronics components
- Applications exposed to paint bake, e-coating, wave soldering, or solder reflow processes
- Bonding aluminum, steel, stainless steel, carbon fiber, GRP, FRP, ABS, and polycarbonate when validated for the application
Available Sizes or Variants
| Size | Case Quantity | Stock Status / Ordering Note |
| 50ml cartridge | 25 per case | Non-stock item. Case order minimum. Order in case quantity multiples. |
| 400ml cartridge | 6 per case | Non-stock item. Case order minimum. Order in case quantity multiples. |
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Permabond’s thermally conductive adhesive range also includes:
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