Description
QGel 300 gel is a clear, very soft two-part silicone encapsulant for protecting electronics from vibration, thermal shock, mechanical shock, and moisture. The system mixes 1:1 and cures at room temperature, so production teams can protect sensitive assemblies without special dispensing equipment.
QGel 300 gel Benefits
- Soft cured gel cushions components and reduces stress on solder joints and fine leads.
- 1:1 mix ratio supports hand mixing or meter-mix work without complex ratio setup.
- Transparent appearance helps inspection teams see components after encapsulation.
- Long 135 minute gel time gives operators time to fill detailed housings and release trapped air.
- Published 24 month shelf life supports stocking for electronics repair and production programs.
This material fits applications where a rigid epoxy or urethane would be too stiff. The cured gel remains soft enough to support service access while still giving the assembly a protective fill against moisture and movement.
QGel 300 gel Applications
- Printed circuit board protection in controls, modules, and small enclosures.
- Sensor, connector, and cable-end encapsulation where rework access may matter.
- LED and power electronics assemblies exposed to vibration or thermal cycling.
- Low-stress fill around fragile components, fine leads, and soldered connections.
- Prototype potting work where clear visibility and hand processing are useful.
Surface Preparation And Use
Start with dry, clean assemblies. Remove flux residue, dust, oil, release agents, and loose particles before filling the housing. Mix Part A and Part B evenly at 1:1 by weight or volume, then dispense slowly to reduce air entrapment around leads and tight corners.
Allow the gel to cure before moving or shipping the assembly. Published cure options include about 20 hours at 25 C, 60 minutes at 100 C, or 30 minutes at 150 C. Test the cure profile on the actual assembly because section depth, housing material, and component mass can change the process window.
Technical Details And Documentation
CHT lists this silicone gel with transparent color, addition cure, 135 minute gel time at 25 C, 1,000 cP Part A viscosity, 2,000 cP Part B viscosity, dielectric strength of 499 V/mil, and service range from -55 C to 204 C. Review current information from CHT Group before production use.
Dispensing And Ordering Help
For related soft potting and encapsulation materials, browse Chemical Concepts encapsulants and potting compounds. For help choosing gel hardness, cure schedule, or packaging, call (800) 220-1966 or email [email protected].








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