QGel 300Y Two Part Silicone Encapsulant Gel

Description

QGel 300Y silicone gel is a two part, one to one silicone encapsulant that cures to a soft gel with noticeably more strength than general purpose potting gels. From Quantum Silicones (CHT), it shields electronics from shock, vibration, thermal cycling, and moisture while staying reworkable for repair.

Where QGel 300Y silicone gel is used

It pots and encapsulates circuit boards, sensors, LED modules, power supplies, and connectors. The cured gel is soft enough to cut and peel back for component access, which makes it a good choice where a hard potting resin would trap a board permanently. It also provides dielectric protection and stress relief on parts that see temperature swings. The soft durometer damps mechanical stress on solder joints and fine leads through repeated heating and cooling.

Working with QGel 300Y silicone gel

Mix the two parts one to one by weight or volume; no special dispensing equipment is required. Gel time runs about 135 minutes at 25 C, with full cure in roughly 20 hours at room temperature. Heat accelerates it, with cure in about 60 minutes at 100 C or 30 minutes at 150 C. Cured material holds service from minus 55 C to 204 C.

Specifications

Order it for board-level potting where soft, reworkable protection matters. For related materials, browse our encapsulants and potting compounds. For full chemistry and datasheet detail, see CHT Group.

Need Help?

Need help matching a potting gel to your cure window and operating range? Call (800) 220-1966 or email [email protected].