Description
The CHT QSil 568 encapsulant is a gray, two-component silicone compound for potting and protection work in LED and electronics assemblies. It is a 100 percent solids material with a semi-thixotropic body, so it can settle around components while resisting the uncontrolled flow of a thin liquid. The product is built for heat cure processing and has a one hour gel time, giving production teams a defined window for filling cavities, leveling around parts, and moving assemblies into cure.
Where this encapsulant fits
QSil 568 fits assemblies that need silicone protection around boards, modules, connectors, lamps, sensors, or other components that may see vibration, thermal cycling, or moisture exposure in service. The semi-thixotropic consistency helps on housings where the material must stay in a controlled pocket instead of running through openings or away from tall features. It is especially useful when a shop wants the compliance of silicone potting without relying on a thin, self-leveling material for every geometry.
Use it after fixture layout, fill depth, and cure schedule are confirmed. The cavity should be clean and dry, with masking or dams in place where the compound must stop. Meter the two components with compatible equipment, dispense into the lowest practical area of the housing, and let the material flow around leads and parts before cure. Avoid trapping air under components, and qualify the fill pattern on a representative assembly before moving into regular production.
How QSil 568 handles electronics work
Silicone potting compounds are chosen when a rigid epoxy would create too much stress on delicate parts. QSil 568 cures into an elastomeric mass that supports components while allowing some movement as materials expand and contract. The gray color helps hide internal components and creates a finished look when the potted surface remains visible. Because heat cure is required, the process should account for oven capacity, part temperature limits, fixture material, and handling time after gel.
encapsulant specifications
| Property | Value |
|---|---|
| SKU | QSIL 568 |
| Brand | CHT Group |
| Product family | QSil silicone potting compound |
| Color | Gray |
| Solids | 100 percent |
| Consistency | Semi-thixotropic |
| Gel time | One hour |
| Cure method | Heat cure required |
| Application | Potting and encapsulation |
Order QSil 568 for electronics assemblies that need a controlled silicone fill and heat-cure processing. Browse related casting and potting compounds for adjacent silicones, gels, and casting materials. For broader silicone material information, visit CHT Group.
Need Help?
Need help matching silicone potting consistency to your housing geometry and cure setup? Call (800) 220-1966 or email [email protected].
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