CHT QSil 573 Thermally Conductive Potting Silicone

Description

CHT QSil 573 Thermally Conductive Potting Silicone is an addition-cure material for electronic potting applications that need thermal transfer, low modulus, and repairable cured silicone. The light gray, two-component system mixes at 1:1 by weight and cures at room temperature.

QSil 573 Benefits

• Good thermal conductivity helps move heat away from potted electronic assemblies.
• 1:1 mix ratio supports straightforward hand mixing or meter-mix dispensing.
• Room temperature cure gives production teams a practical process window.
• Low modulus cured silicone helps reduce stress on protected components.
• Repairable cured material supports service work when assemblies must be accessed.

This silicone is suited to electronics work where thermal path, insulation, and mechanical protection all matter. The mixed viscosity stays at 5,500 cP, which helps it flow into housings and around components without behaving like a thin water-like liquid. Use clean, dry parts and confirm the cure schedule, working time, and dispensing method with the current technical data before production use.

Common Applications for QSil 573

• Thermally managed electronic potting
• Encapsulation of assemblies with heat-producing components
• Industrial modules, sensors, and controls
• Low modulus protection around sensitive parts
• Repairable silicone encapsulation where later access may be needed

Compatible Materials

• Electronic components and assemblies
• Metal and plastic housings verified by trial bonding
• Meter-mix or hand-mix potting processes
• Applications requiring a gray cured silicone

QSil 573 Technical Specifications

Packaging and Ordering

For related silicone potting materials, browse encapsulants and potting compounds. Manufacturer information is available from CHT Group.

Need Help?

If you need help comparing thermal conductivity, viscosity, or cure options for an electronic potting project, call (800) 220-1966 or email [email protected].