Description
Shin-Etsu SES22251-35 is a silicone encapsulant for protective potting, cavity fill, and component support in assemblies that need a compliant cured material. It belongs in electronics and specialty manufacturing work where a hard resin may put too much stress into small parts, leads, or soldered connections.
Where this encapsulant is used
Use SES22251-35 when the approved process calls for a Shin-Etsu silicone fill around components, wire entries, terminals, or small modules. Silicone encapsulation helps support parts during handling and vibration while maintaining a softer body than many epoxy systems. The 35 grade identifier should be treated as part of the specification, not as an interchangeable label.
How this encapsulant supports assembly
Before filling parts, confirm the substrate is clean, dry, and compatible with the silicone system. Dispense slowly into the lowest point of the cavity and let material flow around components rather than trapping air under them. For production release, document fill level, cure conditions, inspection method, and any rework limits so repeat batches match the qualified assembly.
Product specifications
| SKU | SHI-SES22251-35 |
|---|---|
| Brand | Shin-Etsu |
| Product family | SES22251 silicone potting compound |
| Grade | 35 |
| Use | Electronics potting and protective fill |
| Material type | Silicone encapsulation compound |
Order SES22251-35 when your drawing, repair procedure, or approved material list names this exact grade. Browse related silicone potting compounds for adjacent silicone materials and accessories. For manufacturer background, visit Shin-Etsu Silicone.
Need Help?
Need help comparing silicone grades for a production build? Call (800) 220-1966 or email [email protected].
Reviews
There are no reviews yet.