Description
Two-part, room temperature curing conductive adhesive.
Electronically conductive adhesives play an extensive role in manufacturing a wide range of industries such as electronics, solar cell, medical instruments, aerospace and automotive.
Epoxy is a silver filled adhesive designed for making electrical and mechanical attachments on electrical components and devices. Unlike typical room temperature curing systems, this product always results in excellent conductivity and is less sensitive to handling and ambient conditions. Complimentary B components allow for customization of end properties, use B2612 for more flexibility and lower stress, use the standard B component for high strength requirements.
GPC-251A/B
Appearance: Silver
Consistency: Paste
Mix Ratio (by weight): 100 / 5.9 (17 / 1)
Appearance: Silver
Consistency: Paste
Mix Ratio (by weight): 100 / 5.9 (17 / 1)
Pot Life: 60 minutes
TYPICAL CURED PROPERTIES:
Volume Resistivity, max. (25°C) 0.005 Ω-cm
Volume Resistivity, max. (120°C) 0.0002 Ω-cm
Tensile Shear (psi) >1,800
Water Absorption (%) <0.06
Tensile Strength (psi) 11,200
Solvent Resistance Excellent
Solderable No
Specific Gravity 2.7
Thermal Conductivity (W/mK) 6.74
Volume Resistivity, max. (120°C) 0.0002 Ω-cm
Tensile Shear (psi) >1,800
Water Absorption (%) <0.06
Tensile Strength (psi) 11,200
Solvent Resistance Excellent
Solderable No
Specific Gravity 2.7
Thermal Conductivity (W/mK) 6.74
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