Description
Epibond® 200 A/B Adhesive is an extrudable, two-component, room temperature curing epoxy structural adhesive designed for service temperatures up to 200°F (93°C). This adhesive is suitable for bonding a wide variety of materials such as metals, composites, and many other dissimilar substrates.
The combination of high strength and flexibility makes this adhesive well suited for aerospace and other demanding applications
Key Properties:
- 60 Min Working Time
- Flexible Epoxy Gel
- Thixotropic Gap Filling
- High Shear and Peal Strength
- Bonds to wide variety of materials
Reviews
There are no reviews yet.