Permabond ET5424 – High Temperature Epoxy

Description

Permabond ET5424 is a two-part epoxy adhesive designed for demanding structural bonding applications. It cures at room temperature and provides high strength with excellent temperature resistance after cure.

The formulation was developed primarily for aerospace bonding and applications that require long working time, high temperature stability, and low outgassing performance. The adhesive can also be used on parts that must undergo powder coating or paint baking after bonding.

Its extended open time allows accurate positioning of components during assembly, making it suitable for large bond areas and batch production processes.

Key Product Details

Performance values are based on typical laboratory results and may vary depending on surface preparation and bondline thickness.

Performance and Use

• Maintains high strength across a wide temperature range

• Long working time supports large assemblies and batch production

• Cures fully at room temperature with optional heat acceleration

• High temperature resistance suitable for powder coating or paint baking processes

• Formulated with reduced hazard classification on the SDS

Application and Handling Notes

• Surfaces should be clean, dry, and free from grease before bonding.

• Degreasing solvents such as acetone or isopropanol may be used.

• Light abrasion of some metals may improve adhesion by removing oxide layers.

• Parts must be assembled within the usable pot life after mixing.

• Higher temperatures or larger mixed quantities can shorten working time.

Common Applications

• Aerospace structural bonding

• Honeycomb panel bonding and repair

• Metal component bonding

• Assemblies requiring powder coating or paint bake after bonding

• Large bond areas requiring long open time