Description
QSil 220 encapsulant is a two-part, translucent liquid silicone formulated to cure at elevated temperatures for electronics potting and encapsulation. The medium-viscosity system flows around complex parts before cure, delivering electrical insulation and shock resistance to the finished assembly.
QSil 220 Encapsulant Cure and Mix
QSil 220 encapsulant mixes at a convenient 10:1 ratio suited to automatic dispensing equipment as well as hand mixing for smaller batches. The formulation contains no solvents and uses a non-yellowing catalyst system, so cured parts stay clear over time rather than ambering. Heat cure is required to reach full cured properties and adhesion, and the working time exceeds 24 hours prior to cure, giving fabricators room to complete complex pours.
Primerless adhesion to most substrates simplifies encapsulation workflows by removing a surface-prep step common to other potting chemistries. The chemical composition also resists hydrolysis and reversion, supporting long-term performance in humid or thermally cycled service environments.
QSil 220 Encapsulant Electrical Properties
Dielectric strength of 500 V/mil and volume resistivity of 2.57 x 10^14 ohm-cm support use in electronics potting where insulation performance matters. Thermal conductivity of 0.18 W/m-K is typical for unfilled silicone encapsulants. The cured material carries a UL 94 HB listing (control number QMFZ2.E205830) relevant to flammability classification in potted assemblies.
- Two-part, translucent liquid silicone, 10:1 mix ratio.
- Heat cure required for full properties and adhesion.
- Non-yellowing catalyst keeps cured parts clear.
- Primerless adhesion to most substrates.
- UL 94 HB listed, control number QMFZ2.E205830.
Specifications
| Property | Value |
|---|---|
| Mix ratio | 10:1 |
| Viscosity | 4,100 cps (medium) |
| Hardness | 29 Shore A |
| Elongation | 200% |
| Tensile strength | 450 psi |
| Dielectric strength | 500 V/mil |
| Volume resistivity | 2.57 x 10^14 ohm-cm |
| Thermal conductivity | 0.18 W/m-K |
| Working time | Greater than 24 hours |
| Package size | 5 Gallon (Pail Kit) |
Browse encapsulants and potting compounds for related QSil and QGel formulations. Manufacturer technical data is available at CHT Group.
Need Help?
Need help confirming mix ratio, cure schedule, or dielectric requirements for QSil 220 encapsulant? Call (800) 220-1966 or email [email protected].
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