Description
QSil 550LV A/C is a two part, addition cure silicone potting compound engineered for electronic encapsulation applications requiring excellent flow and deep cavity penetration. With a very low viscosity of 1,300 cps per component and a long gel time of 110 minutes at 25 C, QSil 550LV is ideal for potting complex assemblies, tight tolerances, and components sensitive to shear or heat.
This 100 percent solids system cures to a hard, low modulus elastomer that provides thermal conductivity, electrical insulation, and long term stability across a wide temperature range. QSil 550LV is UL 94 V 0 rated and is available in cartridges, quart kits, gallon kits, pails, and drums to support both manual and automated dispensing.
Key Features and Benefits
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Low viscosity for excellent flow and wet out in complex geometries
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100 percent solids, no solvents
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Long gel time for large castings and deep encapsulation
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Thermally conductive properties for heat dissipation
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Electrical insulation with low dissipation factor
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Low modulus to protect sensitive components
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Room temperature cure
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UL 94 V 0 listed
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Simple 1 to 1 mix ratio
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Available for small batch or high volume processing
Common Applications
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Potting and encapsulating electronic modules
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LED drivers, lighting assemblies, and power electronics
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High density circuit assemblies
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Sensors, control units, and transducers
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Automotive and industrial electronics
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Complex assemblies requiring deep penetration
Technical Specifications
Uncatalyzed Properties
| Property | Part A | Part C |
|---|---|---|
| Appearance | Beige | Black |
| Viscosity | 1,300 cps | 1,300 cps |
| Specific Gravity | 1.41 | 1.41 |
Catalyzed Properties
| Property | Value |
|---|---|
| Mix Ratio | 1 to 1 by weight |
| Gel Time at 25 C | 110 minutes |
Cured Properties (7 minutes at 150 C)
| Property | Value |
|---|---|
| Durometer | 62 Shore A |
| Tensile Strength | 450 psi |
| Elongation | 90 percent |
| Tear Strength | 20 ppi |
| Young’s Modulus | 450 psi |
Electrical Properties
| Property | Value |
|---|---|
| Dissipation Factor | 0.001 |
| Dielectric Constant (1 kHz) | 3.12 |
| Volume Resistivity | 1.47 x 10¹⁵ ohm cm |
Thermal Properties
| Property | Value |
|---|---|
| Thermal Conductivity | ~0.37 W/m K |
| Useful Temperature Range | minus 55 C to 204 C |
Certifications
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UL Listed, File QMFZ2.E205830
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UL 94 V 0 at 3.0 mm
Compatible Substrates
Suitable for encapsulating components on:
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Metals
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Plastics
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Ceramics
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PCB assemblies
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Heat generating electronic devices
Packaging and Ordering Information
Available sizes:
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50 ml cartridge
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400 ml cartridge
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2 kg kit (quart)
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10 kg kit (gallon)
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44 kg pail
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440 kg drum
Designed for both manual dispensing and fully automated metering equipment.
For technical questions, dispensing guidance, or volume pricing, contact Chemical Concepts at [email protected] or 800 220 1966. Our team can assist with selecting the right potting silicone for your application.








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