Description
QSil 550LV is a two-part, addition-cure silicone encapsulant from CHT Group built for potting and protecting electronics. Its low viscosity lets it flow around dense boards and into tight cavities, releasing air so the cured part is free of voids. The 1:1 mix by weight keeps batching simple on the bench or in a meter-mix machine.
Where QSil 550LV is used
Reach for it when a circuit assembly needs protection from moisture, vibration, and thermal cycling without trapping bubbles against the components. It pots power supplies, sensors, LED modules, connectors, and control boards. The low modulus and elongation let the cured silicone flex with the assembly through heat-up and cool-down rather than pulling on solder joints, which makes it a steady choice for parts that see temperature swings in service.
How QSil 550LV cures and holds up
Mix the A and B components 1:1 by weight, degas if the application demands it, and pour. Addition cure produces no byproducts and shrinks little, so dimensions stay true. The cured elastomer holds across a wide service window, roughly -55 C to 204 C (-67 F to 399 F), and provides solid dielectric insulation for electrical work. Pot life is generous, which gives time to fill complex housings before the material sets.
Specifications
| Property | Detail |
|---|---|
| Type | Two-part addition-cure silicone encapsulant |
| Mix ratio | 1:1 by weight (A to B) |
| Viscosity | Low, self-leveling for void-free fill |
| Service temperature | -55 C to 204 C (-67 F to 399 F) |
| Cure | Addition cure, no byproducts, low shrink |
| Use | Electronic potting and encapsulation |
Order the size that matches your throughput and housing volume. For related materials, browse our encapsulants and potting compounds. Full chemistry detail is available from CHT Group.
Need Help?
Need help spec’ing a potting silicone for your board and enclosure? Call (800) 220-1966 or email [email protected].
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