CHT QSil 556 Low-Viscosity Potting Silicone

Description

QSil 556 is a two part, addition cure, low viscosity silicone potting material engineered for high reliability electronic encapsulation. This formulation flows easily into tight geometries and deep cavities, providing excellent wet out and component coverage without trapped air. The material offers a room temperature cure profile, enabling production without ovens or elevated heat.

With UL 94 V 0 flame performance, built in contrast enhancement, thermal conductivity, and a long 72 minute gel time, QSil 556 is ideal for potting sensitive electronics, large castings, and assemblies requiring extended working time.

Available in quart, gallon, pail, and drum kits, QSil 556 integrates well with both manual mixing and automated dispensing systems.

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Key Features and Benefits

• Low viscosity for excellent flow and deep cavity penetration

• UL 94 V 0 certified for flame resistance

• Contrast enhancement for improved visual inspection and component visibility

• Room temperature cure for simplified processing

• 100 percent solids, no solvents

• Long gel time for large or complex potting operations

• Low modulus to protect delicate components from stress

• Good elongation and flexibility under thermal cycling

• Thermally conductive formulation

• Electrical insulation with high volume resistivity

• Straightforward 1 to 1 mix ratio

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Common Applications

• Potting and encapsulating electronic power modules

• Automotive electronics and under hood components

• LED drivers and power supplies

• Industrial control boards and sensors

• High voltage insulation assemblies

• Large pours requiring slow gel, low exotherm, and easy flow

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Technical Specifications

Uncatalyzed Properties

Catalyzed Properties

Cured Properties (15 minutes at 150 C)

Electrical Properties

Thermal Properties

Certifications

• UL Listed, File QMFZ2.E20583

• UL 94 V 0 at 3.0 mm

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Compatible Substrates

Suitable for encapsulation on:

• PCB assemblies

• Metal housings

• Plastics

• Ceramic substrates

• Mixed electronic assemblies

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Packaging and Ordering Information

Available sizes:

• 2 kg kit (quart)

• 10 kg kit (gallon)

• 44 kg pail

• 440 kg drum

Supports manual mixing, static mixing, and automated dispensing systems.

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For technical assistance or volume pricing, contact Chemical Concepts at [email protected] or 800 220 1966. Our team can help you select the best encapsulation silicone for your application.