CHT Group

CHT QSil 563 Thermally Conductive Silicone Encapsulant

SKU: QSIL 563

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Description

QSil 563 is a two-part, 100% solids silicone encapsulant for electrical potting applications that need thermal conductivity, flame resistance, and repairable protection. The cured material is hard enough for durable service while keeping a low-modulus silicone profile.

QSil 563 Benefits

  • Thermally conductive fill helps move heat away from potted electronics.
  • Flame-resistant formulation supports electrical assemblies with tighter safety requirements.
  • Low-modulus cured silicone reduces stress on components during temperature cycling.
  • Repairable material can be cut back more easily than many rigid resin systems.
  • 100% solids formulation avoids solvent loss during cure.

This material fits LED, power, control, and electronics assemblies where heat, vibration, and moisture protection all matter. QSil 563 is often considered when a hard epoxy would place too much stress on delicate components.

Where QSil 563 Fits

  • Potting LED modules, drivers, and power electronics.
  • Encapsulating circuit boards that need thermal transfer and protection.
  • Filling electrical housings exposed to vibration or moisture.
  • Protecting sensors, controls, and connectors in industrial assemblies.
  • Repairable silicone potting where service access may be needed later.

Surface Preparation and Use

Clean the housing and components before potting. Remove dust, oil, solder flux residue, and loose particles that could interfere with wet-out or contaminate the potting cavity. Confirm that the assembly is dry before pouring.

Mix the A and B sides thoroughly according to the current technical data sheet. For deeper fills, test the cure profile, exotherm behavior, and air release with the actual cavity geometry before production.

Technical Details and Documentation

CHT product data describes this product as an addition-cure potting material with no solvent added, good thermal conductivity, flame resistance, and repairable cured behavior. Review current product details from CHT Group before finalizing processing conditions.

Ordering Help

For related electronic potting materials, browse Chemical Concepts encapsulants and potting compounds. For help matching hardness, thermal needs, and package size, call (800) 220-1966 or email [email protected].

Additional information

Weight 1 lbs
Dimensions 6 × 6 × 6 in
Manufacturer

Product

QSil 563

Series

Component

Ratio

Type

Must Ship Freight

Ship USPS

Shelf Life (days)

Key Specifications

Application

Adhesive Type Chemistry

Cure Type

Viscosity Specific

Viscosity

Elongation

Hardness

Working Time

Cure Time Generic

Tensile Strength

Dielectric Strength

Volume Resistivity

Thermal Conductivity

Color Family

Color

Yellow

Country Of Manufacture

Origin

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