Description
Shin-Etsu SES22251-20 is a silicone encapsulant for potting and protective fill work in electronic, electrical, and specialty assemblies. Silicone materials are chosen when the cured fill needs to cushion components, tolerate movement, and protect cavities without becoming as rigid as many epoxy potting compounds.
Where this encapsulant is used
Use SES22251-20 in assemblies where wires, terminals, small components, or delicate parts need support inside a housing. A silicone fill helps reduce vibration transfer, limits direct exposure to dust and moisture, and keeps parts from shifting during handling. The 20 grade identifier should be matched to the engineering drawing or qualified material list for the job before release.
How this encapsulant handles production work
Stage the housing, components, mixing tools, and dispensing equipment before opening material. Clean and dry the assembly, then fill slowly so air can escape around corners and lead wires. For repeat work, document mix method, fill depth, cure schedule, and inspection criteria on the first approved build. Do not substitute another hardness or grade without testing the actual assembly.
Product specifications
| SKU | SHI-SES22251-20 |
|---|---|
| Brand | Shin-Etsu |
| Product family | SES22251 silicone potting compound |
| Grade | 20 |
| Use | Potting and protective encapsulation |
| Market fit | Electronics, electrical assemblies, specialty manufacturing |
Order this grade when the approved bill of materials calls for SES22251-20 and confirm cure and handling details against the current technical file before production. Browse related silicone potting compounds for adjacent silicone materials. For manufacturer background, visit Shin-Etsu Silicone.
Need Help?
Need help matching the right grade to your assembly and cure process? Call (800) 220-1966 or email [email protected].
Reviews
There are no reviews yet.