Huntsman

Huntsman Araldite AV 5308 Resin for Araldite 2015, 25 kg

SKU: HUN438208

$2,300.41
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Special Order - 20-25 day lead time.
Note: Special order products cannot be canceled or returned.

Quantity Discount (%) Price
1 $2,300.41
2 6.85 % $2,142.85
4 9.33 % $2,085.70
8+ 11.69 % $2,031.51
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Description

Araldite AV 5308 is the resin side used with Huntsman hardener systems for Araldite 2015 structural epoxy bonding. Huntsman describes the AV 5308 and HV 5309-2 system as a room-temperature curing two-component paste adhesive for resilient bonds, especially on SMC, GRP, and dissimilar substrates.

Araldite AV 5308 Benefits

  • Toughened epoxy paste supports structural bonding where parts may see vibration or movement.
  • Non-sag behavior up to 10 mm helps crews place adhesive on vertical or uneven joints.
  • Useful for GRP, SMC, metal, rigid plastic, ceramic, wood, and mixed-material assemblies.
  • Low shrinkage helps maintain bond-line shape while the adhesive cures.
  • 25 kg resin packaging fits production programs that meter or batch mix larger volumes.

This listing is for the resin component, so it must be paired with the correct Huntsman hardener and mixed at the specified ratio before use. Do not treat the resin as a stand-alone adhesive.

Where Araldite AV 5308 Fits

  • Composite bonding in GRP and SMC panels.
  • Metal-to-composite and plastic-to-composite structural assemblies.
  • Marine, transportation, fixture, and industrial fabrication work.
  • Bond lines that need gap fill without adhesive running out of place.
  • Production systems already qualified around Araldite 2015 chemistry.

Surface Preparation and Use

Bond surfaces should be clean, dry, and properly prepared before adhesive application. Remove release agents, oil, oxidation, dust, and loose fibers. The technical data sheet notes that a 0.05 to 0.10 mm adhesive layer normally gives the best lap shear strength, and parts should be assembled and clamped as soon as adhesive is applied.

Confirm resin, hardener, mix ratio, working time, and cure schedule before production use. Use dispensing equipment or manual mixing methods that maintain ratio control and avoid unmixed streaks in the bond line.

Technical Details and Documentation

Huntsman literature identifies the AV 5308 and HV 5309-2 system as thixotropic, non-sagging to 10 mm, suitable for SMC and GRP bonding, and resistant to environmental conditions after cure. Review current manufacturer information from Huntsman before approving a production process.

Ordering Help

For related structural bonding products and accessories, browse Chemical Concepts structural adhesives. For help confirming hardener pairing, cartridge or bulk dispensing, and substrate preparation, call (800) 220-1966 or email [email protected].

Additional information

Weight 70 lbs
Dimensions 12 × 12 × 16 in
Manufacturer

Adhesive Activator

Packaging Size General

Packaging Size Specific

Length

Width

Color

Beige

Color Number

Cure Time

Size/Volume

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