Description
CHT Group QGel 326 is a QGel 326 silicone gel for soft, transparent encapsulation where electronics need cushioning and moisture protection without a hard potting mass. The two-part addition-cure gel mixes 1:1 by weight and can cure at room temperature or with heat.
QGel 326 Silicone Gel Benefits
- General purpose clear gel suits electronics, connectors, and small protected cavities.
- 1:1 mix ratio keeps setup straightforward for hand mixing or meter-mix dispensing.
- Soft penetration range of 10 to 14 mm helps reduce stress around delicate components.
- Low viscosity sides flow around leads, wire exits, and complex geometry.
- Heat or room-temperature cure options give process flexibility during trials and production.
This gel is a good fit when the assembly needs a very soft fill that can move with parts through vibration and thermal changes. It is softer than many firm encapsulants, so it can cushion components rather than locking them into a rigid block. Confirm cure, adhesion, and appearance in the actual housing before production release.
Common Applications for QGel 326 Silicone Gel
- Electronic module encapsulation with low mechanical stress.
- Connector and cable-exit filling where soft protection is needed.
- Sensor and control housing fills with transparent inspection access.
- Repairable or low-modulus potting work on small assemblies.
- Bench dispensing where dedicated equipment is not required.
Compatible Materials and Handling Notes
- Use on clean electronic assemblies, housings, connectors, and component cavities after testing.
- Keep mixed material uniform so the gel cures consistently across the filled area.
- Limit trapped air when appearance or optical inspection matters.
- Check operating exposure before approving the gel for fuels, cleaners, or harsh chemicals.
QGel 326 Silicone Gel Technical Specifications
| Property | Value |
|---|---|
| SKU | QUA QGEL 326 |
| Product type | General purpose silicone gel |
| Cure type | Addition cure |
| Color | Transparent |
| Mix ratio by weight | 1:1 |
| Gel time at 25 C | 2.5 hours |
| Cure profile | 30 minutes at 150 C, 60 minutes at 100 C, or 24 hours at 25 C |
| Penetration | 10 to 14 mm with 19.5 g cone |
| Viscosity | 800 cP A side, 950 cP B side |
| Working temperature range | -55 C to 204 C |
Packaging and Ordering
Order this gel when a very soft, clear encapsulant is needed for electronics, connectors, or low-stress potting. Browse related encapsulants and potting compounds, and review current manufacturer capabilities from CHT.
Need Help?
Need help selecting gel softness, cure schedule, or dispensing method for your assembly? Call (800) 220-1966 or email [email protected].
Reviews
There are no reviews yet.