Description
QSil 550F is a two part, fast curing, addition cure silicone potting material designed for electrical and electronic encapsulation. The system cures to a hard yet low modulus elastomer that provides excellent thermal conductivity, good elongation, and reliable protection in demanding environments. With a rapid 7 minute gel time at 25 C and UL 94 V 0 compliance, QSil 550F is engineered for high volume production where speed, repeatability, and electrical insulation are critical.
QSil 550F mixes at a simple 1 to 1 ratio and is available in cartridges, quart kits, gallon kits, pails, and drums to support both small batch and automated production processes.
Key Features and Benefits
-
Fast gel time for high throughput production
-
100 percent silicone elastomer
-
Low modulus to protect delicate components
-
Thermally conductive formulation for heat management
-
Electrical insulation with very low dissipation factor
-
UL 94 V 0 rated at 3.0 mm for flame resistance
-
Good elongation and mechanical flexibility
-
Simple 1 to 1 mix ratio
-
Repairable cured material for rework needs
Common Applications
-
Electronic module potting
-
Automotive control components
-
LED drivers and lighting assemblies
-
Power supplies and converters
-
Sensors and instrumentation
-
High temperature electronics
-
Circuit board protection
-
Industrial and aerospace electronics
Technical Specifications
Uncatalyzed Properties
| Property | Part A | Part B |
|---|---|---|
| Appearance | Beige | Black |
| Viscosity | 3,500 cps | 3,500 cps |
| Specific Gravity | 1.39 | 1.39 |
Catalyzed Properties
| Property | Value |
|---|---|
| Mix Ratio | 1 to 1 by weight |
| Gel Time at 25 C | 7 minutes |
Cured Properties (7 minutes at 150 C)
| Property | Value |
|---|---|
| Durometer | 60 Shore A |
| Tensile Strength | 611 psi |
| Elongation | 112 percent |
| Tear Strength | 25 ppi |
| Useful Temperature Range | minus 55 C to 204 C |
Electrical Properties
| Property | Value |
|---|---|
| Dissipation Factor | 0.003 |
| Dielectric Constant (1 kHz) | 3.12 |
| Volume Resistivity | 1.47 x 10¹⁵ ohm cm |
Thermal Properties
| Property | Value |
|---|---|
| Thermal Conductivity | ~0.37 W/m K |
Certifications
-
UL Listed, File QMFZ2.E205830
-
UL 94 V-0 at 3.0 mm
Compatible Substrates
QSil 550F is suitable for potting and encapsulating components on:
-
Plastics
-
Metals
-
PCB assemblies
-
Ceramic components
-
Heat generating devices
-
Mixed electronics assemblies
Packaging and Ordering Information
Available package sizes:
-
400 ml cartridge set (A/B)
-
2 kg kit (quart)
-
10 kg kit (gallon)
-
44 kg pail
-
440 kg drum
For bulk users, pails and drums pair well with automated mixing and dispensing systems.
For technical guidance, material compatibility questions, or bulk pricing, contact Chemical Concepts at [email protected] or 800 220 1966. Our team can recommend the best silicone encapsulation solution for your application.
Reviews
There are no reviews yet.